Click on image for thermal imaging movie.    

SASE’s philosophy is that higher cost technology can enable the development of a lower cost manufactured embedded design. Whether achieved through electronic integration or optimized engineering practices, we have found it necessary to qualify and correlate any design analysis with empirical measurements with the delivery of the first working prototype. Consequently, we have acquired thermal imaging as well as other instrumentation capabilities to deliver reliable and functional products in the shortest time and the lowest cost. Looking beyond the electrical bill of material, one needs to understand the full cost of manufacturing, product life cycle, and extended product cost. Our methodologies examine manufacturing and process optimization as well as other design facets that minimize power dissipation while improving thermal performance that allow our designs to utilize the lowest cost boards (PCB), mechanical designs and assembly processes possible.

SASE can also provide analysis, thermal and instrumentation services to identify component or design concerns in a current product. We can quantify and determine the source of poor thermal performance while making recommendations for corrective action. Furthermore, we have the capability to quantify and predict the reliability of an embedded design.

Please take this opportunity to contact us to discuss in further detail your thermal analysis needs.  We can be reached at (248) 693-0551 or by email at info@e-sase.com. Alternatively, you can fill in and submit the project request form and expect to hear from us within 2 business days.